While I have more in depth experience with using the cleanroom from the research I performed during my undergraduate studies, I wanted to highlight the overall cleanroom skills I acquired from another lab class that I took in IC development. This class accompanied a lecture class on semiconductor devices. The two went hand in hand in teaching us how to make the best devices within the cleanroom and why such an environment is needed for their fabrication.
We used a variety of machines to deposit both metals and oxides, spin resist and create photo-lithographic masks, and etch and layer those mask patterns on our wafers to create specific designs and devices. We learned how to monitor the processes so that we didn't need to start over on any steps and create some good devices with proper feature specifications. Other skills we learned include cleaning and cleaving the wafers, as well as measuring their properties, such as voltage across MOSFET devices and oxide thickness. Of course, we also learned proper procedures to follow in first-aid and emergency situations.
Among the final deliverables for the course, we made wafers full of functioning MOSFETS, as well as a tricolor dielectric image using various masks for red, green, and blue layers (colors dependent on oxide thickness). I learned a great deal about what kinds of devices are enable by a cleanroom as well as the limits to current technologies. The lecture portion of the class covered a variety of theories on how cleanroom technologies could be enhanced to enable even smaller feature sizes.